Devices like the Apple Vision Pro will most certainly benefit from the xMEMS XMC-2400 µCooling chip, which boasts the world’s smallest active cooling fan. At just 9.26 x 7.6 x 1.08 mm and weighing less than 150 milligrams, it’s approximately 96% smaller and lighter than non-silicon-based, active-cooling alternatives.
A single fingertip-sized XMC-2400 chip can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure, while the all-silicon solution also offers semiconductor reliability, part-to-part uniformity, high robustness, as well as sporting an IP58 rating. Samples will begin shipping to device manufacturers in Q1 2025.
- Purposeful Design: Travel with ease and look great doing it with the Aspire's 3 thin, light design.
- Ready-to-Go Performance: The Aspire 3 is ready-to-go with the latest AMD Ryzen 3 7320U Processor with Radeon Graphics—ideal for the entire family,...
- Visibly Stunning: Experience sharp details and crisp colors on the 15.6" Full HD IPS display with 16:9 aspect ratio and narrow bezels.
Our revolutionary µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing. Thermal management in ultramobile devices, which are beginning to run even more processor-intensive AI applications, is a massive challenge for manufacturers and consumers. Until XMC-2400, there’s been no active-cooling solution because the devices are so small and thin,” said Joseph Jiang, xMEMS CEO and Co-Founder.
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