Photo credit: OnLeaks
Analysts report that TSMC will ramp production in June for Apple’s next-generation A13 chip, which is set to be used in the three iPhone models that will be revealed in September. It uses the chip manufacturer’s second-generation 7nm process, and the first to use extreme ultraviolet (EUV) lithography. Next year, the rumored A14 will most likely be paired with a Qualcomm Snapdragon X55 modem for 5G connectivity. Read more for a video and additional information.
“The follow-ups to the iPhone XS and iPhone XS Max that will launch later this year will reportedly be about a half millimeter thicker and will feature triple cameras on the back. The iPhone XR replacement will allegedly ditch its single rear camera for a dual-camera arrangement. Other changes reportedly on the docket include larger batteries across the board, improved antenna materials to improve reception, and support for reverse wireless charging,” reports Hot Hardware.