Here’s an alleged image of the upcoming Mac Pro 7.1 refresh from an internal Apple presentation slide. Labeled “Mac Pro 7.1” and codenamed “Phoenix,” it shows a square design that measures in at 7.7 x 11.55 x 11.55 inches, comes equipped with an Intel Xeon W Cascade Lake-X processor, an Apple T2 security chip, an “Apple X2 Accelerator,” AMD Firepro-X memory, as well as DD45 SO-DIMM memory. Will this be the hardware shown at WWDC 2019? You’ll have to tune in on June 3rd. Read more to see the full slide.
Photo credit: Imgur
“As far as other specifications, the Mac Pro is said to come with eight Thunderbolt 3 ports with ‘Thunderbolt 4’ compatibility, two HDMI 2.1 ports and support for 10-gigabit Ethernet and Bluetooth 5.1. The new Mac Pro is also expected to adopt a stackable module system. The only required module would be the “brain,” which will likely contain the logic board and other critical components. Everything else, such as additional storage, memory and upgraded GPUs, could be addable in optional modules,” reports iDropNews.
