It’s official, Samsung’s LPDDR5X DRAM packages for on-device AI is now the world’s thinnest and it has just gone into mass production. More specifically, the 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages.
These ultra-slim LPDDR5X DRAM packages offer the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation. The design also allows manufacturers to create additional space within mobile devices, facilitating better airflow, which is crucial for on-device AI. Utilizing printed circuit board (PCB) and epoxy molding compound (EMC)² techniques, this new LPDDR DRAM package is as thin as a fingernail, measuring just 0.65mm thick.
- Boosts System Performance: 32GB DDR4 Pro Series desktop memory RAM kit (2x16GB) that operates at 3200MHz, 3000MHz, or 2666MHz to improve multitasking...
- Accelerated gaming performance: Every millisecond gained in fast-paced gameplay counts—power through heavy workloads and benefit from versatile...
- Optimized DDR4 compatibility: Best for 8th -13th Gen Intel Core and AMD Ryzen 1000-5000 Series processors — Supports Intel XMP 2.0 to recover memory...
Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package. We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics.
